Copper-graphite composites are also used as heat sinks in electronic devices, such as computers and smartphones, because of their excellent thermal conductivity and low coefficient of thermal expansion. In this work, Cu-graphite composites produced via Gas infiltration pressure method. From the powder mixture of graphite and carbide forming elemental powder via gas pressure infiltration with molten copper alloy in 40 – 80 vol.% of graphite. Results revealed that the gas pressure infiltration of graphite powder into the copper matrix improved the wettability between copper matrix and graphite reinforcement.