In recent decades, Co-Ni-Ga shape memory alloys gained a lot of attention as promising candidates for high temperature actuation and damping applications. However, recent studies mainly focused on single crystalline material since polycrystalline alloys suffer significant deformation constraints, due to the pronounced anisotropic material behavior. Grain constraints upon loading can result in a significant defect formation, which can only be kept at a minimum when processing achieves an appropriately textured material and/or suppress unfavorable grain boundaries, i.e. triple junctions. Recent studies have shown that oligocrystalline microstructures, also referred to as bamboo structures, can be beneficial for a reversible material´s response. Beside an appropriate texture, grain boundary misorientation is a key parameter for local stresses/strains evolution at grain boundaries.

Therefore, this work focuses on the different processing routes to design the microstructural properties for improved functional properties, i.e. hot rolling, additive manufacturing and extrusion followed by subsequent recrystallization heat treatments.