Currently, interface electronics for communicating and storing data is a key issue to serve a plethora of applications, such as security applications and for the internet of things (IoT) that is growing and so, demanding more data to be handled. This has been pushing to the limits the use of silicon for a broad range of applications that can be easily replaced, for which speed of data transmission or storing is not a limiting factor. Moreover, more and more sensing devices are required to support security actions, comfort, and welfare for all, mainly using conformable low-cost substrates.

Metal oxides at a nanoscale, together with printed electronics can answer to most of these demands, reverting the push to the need for silicon chips by exploiting green technologies sustained by abundant materials, leading so to the reduction of carbon footprint, and paving the way for green electronics. In this presentation, we will focus on the recent developments achieved by using eco-friendly materials in processing n and p-type thin film transistors and their integration on devices and flexible and conformable systems, namely the ones achieved @cenimat/i3N

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