Technische Universität Berlin
In
the transition from a linear to a circular economy, fungal mycelium-based materials
are an upcoming class of materials as a sustainable alternative to animal and petroleum-based
materials [1]. In addition to being bio-based and biodegradable, fungal mycelium has the advantage of
the ability to consume lignocellulosic biomass, e.g. from agricultural side-streams,
forming fungal mycelium-based composites with low or even negative CO2
footprints. Commonly, fungal composites are processed by moulding [1]. In recent
years, extrusion-based additive manufacturing (extrusion-based AM) has emerged
as a promising alternative approach for design or engineering needs with fungal
mycelium, as extrusion-based AM offers e.g. much higher design freedom in
geometry and complexity [2,3]. However, it is still in its early stages of
development.
Here
we present an extrusion-based AM approach to print fungal mycelium-based
composites based on two printing pastes
from the fungus F. fomentarius with
either inactive [5] or inoculated living fungal mycelia [4]. While inactive
fungal mycelium worked as a fibre-reinforcing agent [5], living fungal mycelium
provided additional properties due to its active growth. A suitable paste
formula was proposed for the latter, which kept fungal vitality and promoted
fungal growth after printing. Thus, lightweight composites with hydrophobic
surface and printing accuracy down to millimetre level and printing heights up
to 30 mm in complex shapes have been printed (Figure 1) [4]. By separating the
fungal mycelium skin from the printed substrate after inactivation and drying, 3D
fungal skins have been prepared, which will open new paths in fungal
mycelium-based materials production.
References
[1] N. K.
Sreerag et al. Polym. Rev., 2025, 65:1, 169–198.
[2] A.
Mohseni et al. biomimetics, 2023, 8:2, 1–24.
[3] S. Gantenbein et al. Nat. Mater.,
2023, 22, 128–134.
[4] H. Chen et al. Mater. Adv., 2025, 6, 5149–5158.
[5] H. Chen et al. Fungal Biol. Biotechnol., 2021, 8:21, 1–11.
Abstract
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