In microchip testing, scanning acoustic microscopy has been used successfully for a long time. The potential of this method for the characterization of hybrid lightweight materials, comprising light alloys or CFRP, has now been investigated within the SmartPro project. Focusing the ultrasonic beam into different depths enables the high-resolution and depth-resolved imaging of defects and pores within adhesive layers or within the material bulk. Cross-sectional images provide additional information, for example interfacial waviness. Surface structuring, due to laser pre-treatment of CFRP for example, or the heat-affected zone below the surface can also be recognized. 

A measurement takes only a few minutes with usual sample size, one-sided access to the component is sufficient. Thin-walled components with any surface expansion can be examined with high resolution and very quickly; 3-D representation is possible. The measurement results are compared with those of X-ray computed tomography.

Benz, Schmeckenbecher, Schuhmacher, Meinhard, Kallien HS Aalen
Djuric-Rissner, Czurratis PVA Tepla AS GmbH