Due to its excellent light transmission, low conductivity, high chemical stability, and great mechanical strength, glass has always been an important material in the industry. Recently, with the increasing demand for ICT and consumers’ electronics, either as a display or a high-density integrated circuit board, glass is always serving as a prospective solution. Therefore, the technique of precision machining on glass is a matter that must be faced. Key technologies involved include, for example, micro-drilling for blinds and vias, patterning micro-metallization for conductors, and glass welding for the multi-layered glass circuit board and encapsulation lid for organic electronics and optoelectronics. The high stabilities and chemical inertness of glass, however, make it difficult for processing. Over the past decade, the laser has been developed as a promising tool for glass welding. Recent research results have also demonstrated that the high-quality joining performance of glass fusion welding can be achieved by the incident beam from a femtosecond laser. In this study, we explore the relationships between bonding strength and several key laser processing parameters such as laser power, focal point position, scanning speed, and repetitive scan times. Our experimental results show the focal positions and repeat scan times are both statistically significant for the resulting bonding strength. We also discuss the importance and thresholds of the processing parameters by the methods of regression models and decision trees. In the meantime, the scanning speed can reach up to 2,100 mm/s, indicating our approach has the potential for mass production. The findings in this study also highlight the importance of the relationships between the bonding strength and the related laser parameters.