The micromechanical robustness of modern micro- and nanoelectronic devices under complex loading conditions is critical for their reliability and performance. Understanding their micromechanical failures and failure modes is necessary to enhance the durability and functionality of these devices. This study focuses on the advanced experimental assessment of micromechanical reliability in microelectronic structures using a combination of variable loading micromechanical testing and acoustic emission techniques.

To exemplarily show the workflow, the micromechanical loading of copper micro-pillar structures is investigated. Copper micro-pillars are integral components in modern microelectronic devices, and their mechanical integrity including their under-pillar metallisation structures is crucial for device robustness. Through precise micromechanical testing, we simulate various loading conditions to observe the onset and progression of failure mechanisms within these structures. Acoustic emission monitoring provides real-time data on the dynamic processes occurring during loading, offering insights into the initiation and propagation of micro-cracks and other failure modes.

Furthermore, the integration of finite element modelling (FEM) with advanced micro-fracture testing enables a comprehensive analysis of the experimental results. FEM simulations help in predicting stress distribution and identifying critical regions susceptible to failure. By correlating these predictions with empirical data from micro-fracture tests, we achieve an extended interpretation of the micromechanical behaviour of copper pillar structures.

This combined methodological approach not only enhances our understanding of micromechanical failures in microelectronic structures but also provides a robust framework for assessing the micromechanical reliability of these and other devices under complex loading scenarios. The findings from this study have significant implications for the design and optimization of microelectronic components, ensuring their performance and longevity in practical applications.