In the last few years there has been a significant increase in energy consumption. This phenomenon involves the risk of overloading the power grid, which results in the need to increase the capacity of the high-voltage line voltage. The increase in the efficiency of electrical wires forces more stringent conditions for the operation of devices such as contacts that are involved in electricity transmission and distribution systems (higher loads, operation at higher temperatures). Contact resistance affects energy efficiency, stable voltages, long life-expectancy. Therefore, it is important to protect the surface of contacts from the formation of a passivation oxide layer on their surface. During the research work, the focus was on the production of coatings by thermal silver plating as an alternative to coatings produced by galvanization. The copper particles are added to silver coatings to improve mechanical properties and tarnish resistance. In order to ensure the proper rheological properties of the composite used for coatings production, it was required to prepare copper powders with an appropriate grain size, not greater than 5 µm. During the chemical synthesis of copper powders the different concentrations of copper sulphate were used. Copper powder with a d90 value of not more than 5 µm was selected for the coating.  The obtained coating was tested for cohesion and adhesion using an automatic adhesion tester and the contact resistivity of the produced coating was determined using the Kelvin Bridge method using a digital low-resistance ohmmeter both before and after accelerated thermal aging. The samples were tested for an electric current of 200 A and a pressure range of 5.5 to 34 kg/cm² before and after thermal aging. Resistance before thermal aging was below 0.025 μΩ/cm², after aging it did not deteriorate and was below 0.2 μΩ/cm².