Electromagnetic pulse welding (EMPW) is a high-velocity impact joining process which is employed with the intention to form fast and effective solid-state bonds. This study investigated different regions of an EMPW interface in similar 6xxx series Al/Al joints, to elucidate the bonding mechanism across the interface. Within the limited published literature there is still debate on the occurrence and role of local melting along the joint-interface. It is important to determine whether, how, and where local melting occurs as the literature is at odds with whether it is necessary for bonding or if its occurrence is detrimental. It was shown that bonding was not accomplished fully in the solid state, but instead that there was indirect evidence that local melting occurred. These locally melted areas likely occur around the point of first contact during the welding process and are associated with a debonded region that runs alongside or through the centre of melted zones. Samples of a commercial AA6008 in the T7 temper and an extruded high strength 6xxx series alloy in the T6 temper were bonded and the microstructures were investigated. Microstructural characterisation was accomplished using scanning electron microscopy with energy dispersive x-ray spectroscopy (EDS), electron backscatter diffraction, transmission Kikuchi diffraction and scanning transmission electron microscopy with EDS and revealed distinctive features in the locally melted areas including: dispersoids free regions, columnar grains and epitaxial growth, and localised increases in O, Fe, Si, and Mn content. The apparently melted regions contrasts with the solid-state bonded region, where the interface exhibited sub-micron grains and no loss of dispersoids or local increase in O, Fe, Si, and Mn.