International Conference on System-Integrated Intelligence - SysInt 2025
Lecture
04.06.2025 (CEST)
Hybrid circuit integration of commercial silicon ICs into flexible substrates
SP

Sumantha Aithal Panambur (M.Sc.)

Universität Bremen

Panambur, S.A. (V)¹; Bornemann, S.¹; Lüssem, B.¹
¹University of Bremen
Vorschau
13 Min. Untertitel (CC)

Flexible electronics shows great potential for the healthcare industry and the upcoming generation of consumer electronics. This technology is ideal for sensor systems that are directly applied to the skin, where a certain flexibility is required to accommodate skin movement. Several large-area transistor and sensor technologies were proposed that can be seamlessly manufactured on thin, biocompatible, and flexible foil substrates. Organic Electrochemical Transistors (OECTs) are amongst the most promising devices and have been evaluated as biosensors for multiple applications such as sampling of glucose, sensing various ions and their concentration. At the same time the sensor data has to be retrieved non-invasively and wirelessly, which can be facilitated with a high-frequency Radio Frequency Identification (RFID) interface.  However, realizing the communication interface using organic semiconducting materials is currently not possible due to the limitations of the material. Therefore, we present our approach of hybrid integration of a high-speed silicon-based, rigid Integrated Circuit (IC) into the thin flexible foil to create a fast communication interface with simultaneous energy supply for OECT sensors based on international standards.

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