FEMS EUROMAT 2023
Lecture
04.09.2023
Laser fabricated Ag nanoparticle conductive grids as bottom electrode for flexible ITO-free organic photovoltaics
KA

Kostas Andritsos

National Technical University of Athens

Andritsos, K. (Speaker)¹; Pozov, S.²; Theodorakos, I.¹; Ioakeimidis, A.²; Kabla, A.³; Melamed, S.³; de la Vega, F.³; Choulis, S.A.²; Zergioti, I.¹
¹National Technical University of Athens; ²Cyprus University of Technology, Limassol (Cyprus); ³PV Nano Cell Ltd., Migdal Haemek (Israel)
Vorschau
20 Min. Untertitel (CC)

Laser-induced forward transfer (LIFT) and laser sintering of metal nanoparticle inks represent a two-step digital fabrication method that has emerged as a key technology for the fabrication of flexible microelectronic devices with enhanced lifetimes under electrical and mechanical stress [1]. In this work, we will present the investigation of the laser printing and sintering process of Ag nanoparticle inks for the fabrication of a conductive grid composed of parallel lines as a replacement for the indium tin oxide (ITO) bottom electrode in flexible organic photovoltaics (OPVs). Accordingly, we investigate the effect of a number of laser parameters and their influence on the morphological properties and electrical performance of the laser-printed conductive grid. The electrical conductivity of the laser-printed lines is calculated using electrical measurements in a 4-point probe IV station, while their morphological properties are evaluated using profilometry measurements. As a result, laser-printed Ag grids as bottom electrodes on flexible substrates are presented, exhibiting comparable sheet resistance and transparency values to that achieved with commonly used and highly cost ITO based electrodes [2]. The proposed laser printed and sintered metal grid is used as bottom electrode for the fabrication of efficient flexible ITO-free inverted OPVs. The results confirm that the combination of Ag nanoparticles laser printing and sintering is a promising technique that can offer cost-effective electrodes for applications in flexible ITO-free OPVs.

Abstract

Abstract

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