Nanojoining is a relatively new joining process that allows lower joining temperatures compared to conventional soldering or brazing processes. In electronics, nanojoining has already found its way into industrial production as an alternative for soldering. In this poster contribution, we want to answer the question whether nanojoining can also be an alternative for brazing, i.e. for higher-stressed components. For this purpose, Cu substrates were joined with an Ag nanopaste and Ni superalloys were joined with a Ni nanopaste. The joints were compared with conventionally brazed joints. It is shown that nanojoining can indeed be an alternative for brazed joints, but process-related particularities have to be taken into account.