Silver lines of four layers were plotted on copper sheets using inkjet printing. It was intended to examine the effectiveness of the sintering process on the formation of coherent silver lines with minimum porosity content. The choice of the copper substrate was made to allow examination of microstructure development, porosity, and interface coherency upon subjecting the plotted layers to plastic deformation using rolling. The preliminary results indicate that sintering at 300°C provides better coalescence of the plotted Ag nanoparticles reducing the amount of porosity and enhancing the coherence at the Ag/Cu interface. Rolling the sintered samples was shown to significantly reduce the amount of porosity and further improving the coherency of the Ag layer. It also demonstrates that increasing the amount of rolling reduction provided more homogeneous refinement of the Ag grains to an average size less 500 nm.