Conference on Artificial Intelligence in Materials Science and Engineering - AI MSE 2023
Lecture
23.11.2023
In situ crack detection in additive manufacturing based on acoustic emission and machine learning methods
DC

Dr. Dmitry Chernyavsky

Leibniz IFW Dresden

Chernyavsky, D. (Speaker)¹
¹Leibniz IFW Dresden
Vorschau
17 Min. Untertitel (CC)

Owing to layer-by-layer processing, additive manufacturing (AM) provides high flexibility in manufacturing components allowing virtually infinite geometric freedom. The use of AM and its particular realization – laser powder bed fusion – is rising. However, the method is not free from flaws, mainly represented by structural defects of the printed specimen, such as cracks and pores, requiring processing monitoring. Using a structure-borne high-frequency sensor makes it possible to detect acoustic emission (AE) associated with cracking, which occurs not only during the printing process but also after its completion. We discuss the machine learning approaches elaborated by our group aimed at in situ crack detection by the AE analysis.

Abstract

Abstract

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