Fraunhofer-Institut für Werkzeugmaschinen und Umformtechnik IWU
The potential of metal foam structures for use as heat sinks in thermal management is one component of the battery development in the EC-funded MARBEL project, in which 16 partners from 8 countries are working on the next generation of battery systems. The targeted 300-thousand kilometer service life along with shortened charging times are in reach through precise temperature control of the battery cells. For fast and comprehensive heat transfer under load, not only the pressure and quantity but also the shape of the flow of the cooling liquid plays a decisive role. The integration of cellular structures inside channels and cooling areas increases the internal surface area and creates turbulences in the cooling liquid. Within the project the extent of the effect and influence of density, cell size and connection to the heat source are investigated.
Knowledge of the behavior and flow resistance of the foam structures will enable a defined selection and adaptation of these cellular structures to the individual requirements of each application.
In contrast to the increase in heat generation per surface area, the available installation space for cooling usually decreases. Therefore the demand on the efficiency of the systems increases. The approaches pursued are a fundamental building block on the way to an industrially suitable solution to this challenging task. By optimizing the integration and connection of the foam structure, adjusting the density up to a defined variation of the porosity within a component and a clever choice of materials, the cooling effect was significantly increased. Meanwhile the complexity and thus the costs of the components can be reduced. The development is accompanied by considerations of sustainability and recyclability and generates findings that not only form the next generation of battery technology, but also the basis for further development and simulation projects from other fields of application to meet the increasing requirements of power electronics.
Abstract
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