6th Euro BioMAT 2021 - European Symposium on Biomaterials and Related Areas
Poster
05.05.2021
Integration of electric circuits into microprinted cell culture scaffolds for three-dimensional microelectrode arrays
MS

Malte Siegmund (B.Sc.)

Universität Hamburg

Siegmund, M. (Speaker)¹; Blick, R.H.¹; Harberts, J.¹; Zierold, R.¹
¹Universität Hamburg
Vorschau
3 Min. Untertitel (CC)

Microelectrode arrays (MEAs) for non-invasive electrical readout of neurons are a valuable tool for long-term studies of neuronal network signalling. Traditionally, MEAs are built in 2D and thus do not represent the natural three-dimensional network topology of the brain. Recently, we presented direct laser written (DLW) cell culture scaffolds which could be used to realize 3D cell culture on brain-on-a-chip (BoC) devices. Tower-like scaffolds were used for controlled cultivation of 3D neuronal networks characterized by individual—and invasive—patch clamp measurements. However, for non-invasive long-term experiments which also allow for detailed network analysis, an addressable extracellular electrical readout must be implemented. Here, we present an approach using electrodeposition (ED) of gold to integrate electric circuits into hollow DLW written towers. Individual towers are addressed by using a tailor-made MEA as substrate for printing. The porosity of the gold can be tuned by changing the deposition rate and allows for optimising the surface topography to enhance cell coupling to the electrode. Addressable electrodes within the third dimension take a significant step toward the application in information processing by neurons and the understanding of underlaying mechanism orchestrating information procession. Future work will be focused on the implementation of a multichannel readout system and the refinement of the scaffold structure to allow for a space and time resolved cell specific electrical readout.

Abstract

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