Numerous industrial sectors, such as the automotive industry, telecommunications and sensor technology, show an increasing demand for molded interconnect devices (MIDs). These components are distinguished by their low weight and electrical conductivity. Usually, laser direct structuring (LDS) or two-shot injection molding is used for this purpose [1].
In this work, the conductive track is realized via direct laser-based selective activation (LSA) of the polymer [2]. In this process, pulsed laser radiation is used to pattern the surface. Afterwards, the specimen passes through a nucleation bath of PdCl2 and a copper bath consisting on a CuSo4 solution. In contrast to LDS, conventional injection molding polymers without additives can be used for the process.
In this work, the copper plated surfaces are investigated as a function of laser and scan parameters. The resulting track are analyzed for homogeneity, mechanically adhesion and electrically conductivity. Scanning electron microscopy (SEM) characterization allowed a deeper understanding on the relationship between surface topography and the applied pulse duration and scanning parameters.