The microstructure of Sn-Ag-Cu alloys consists of β-Sn-dendrites and precipitation strengthened eutectic regions. In addition, elements such as Sb, Bi, Ni and In are used as solid solution hardening elements in some alloys to improve the creep resistance. Even though these alloys have been used as interconnects for many years, there are no explicit investigations into the influence of the silver content in combination with the addition of solid solution hardening elements. In this regard, the main goal of our research is to lay the foundation for further development of solder alloys with higher reliability and lower costs.