High-throughput laser single pulse micro-drilling is highly demanded technology for various applications such as filters, acoustic panels, surfaces with better aerodynamic performance, etc. In particular, rates in the order of 102 holes per second can be obtained during the production of industrially relevant parts such as micro-drilled structures for the leading edges of aircraft wings equipped with HLFC technology for reducing drag [1]. The laser micro-drilling process is, however, very sensitive to deviations in the working distance (distance between the head nozzle and the sample). Deviations of only 25 microns can alter the diameter of the holes and hence, the performance of the micro-drilled part [2]. Therefore, real-time control associated with one or more monitoring techniques is necessary. Here a system based on the capture of laser light not absorbed in the process and scattered by the surface of the sample or by material removed in the micro-drilling process is presented. The scattered laser radiation monitoring system is based on a fiber optic bundle attached to a photodiode. This method makes it possible to capture the scattered laser radiation symmetrically around the area where the micro-perforation is performed and reduce the number of used photodiodes to two: one for monitoring at beam entrance and another for monitoring at the beam exit. The fiber optic bundle, in turn, allows the fiber inputs to be easily integrated into the laser head and into a system at the beam exit area that accompanies the movement of the laser head. Two types of analysis can be carried out at both sides of the sample: intensity monitoring and time resolved monitoring. The former can be used as a deviation detector by choosing a confidence interval as reference and the latter as a real measurement of the drilling time. Both measurements are quite sensitive to the various configuration parameters of the micro-drilling laser process and provide real-time information. Figure 1 shows the drilling time measured with this system as a function of working distance and focus position during single pulse drilling on a 0.8 mm thick Ti sample. The drilling time presents a non-trivial dependence on both parameters and therefore sensitivity to deviations in the working distance and/or the position of the focusing optical system. Minimizing deviations is crucial when manufacturing large micro-perforated parts. Deviations in the established working distance appear mainly because of the accumulated mechanical stress that each hole induces in the sample and that tend to bend it as more and more holes are produced. A sheet that is not perfectly flat or local deformations prior to processing are another source for the occurrence of deviations in laser micro-drilling. Here we show that the laser scattered monitoring technique described in this work represents a low-cost alternative to both accompany the single pulse drilling process as well to provide additional information to other established monitoring techniques.