This work introduces an environmentally friendly method using nanostructured copper surfaces to form strong, electrically conductive bonds for power electronics and battery components, addressing a key limitation of conventional conductive adhesives. Traditional adhesives often require conductive fillers, leading to trade-offs between bond strength and conductivity and complicating processing. In contrast, nanostructured copper’s unique surface features act as their own metallic filler, enabling robust, lower-temperature bonding without these compromises, making it an innovative alternative to traditional soldering and adhesives.