Printed Circuit Boards (PCBs) are the most common electronic substrate. Their insulating component is commonly made of glass fibers and epoxy resins (usually FR4), ensuring good performance at a low cost. Such polishes contain brominated flame retardants, which are dangerous for the human neurological and reproductive systems and were found to be cancerogenic.[1] Moreover, PCBs were designed without considering their end-of-life. Environmentally friendly PCBs are thus required to deal with these issues and reduce electronic waste.[1,2]

Our work proposes a polylactic acid cotton fabric-based PCB that is compostable. The substrate is produced simply by compression molding. As a result, its fabrication is compatible with the polymer industry. Because its morphology and wettability are similar to standard FR4, conductive silver ink can be printed on top. Its dielectric constant is comparable to that of standard FR4. Micro drilling, which is essential for integrated circuit connections, is done efficiently. Because a thermoplastic polymer is utilized, the PCB may be molded to curved surfaces while retaining the conductivity of the silver tracks. Such green PCBs built of compostable materials could help minimize the massive quantity of electronic waste in landfills.