Infrared sensors can screen invisible objects or elements, solving vulnerabilities such as riders, radars, and visible light image sensors that are in use. Considering wafer-level molding, microlenses and their arrays are simultaneously molded into geometric lenses of tens to hundreds of microscale dimensions, and the molding/imprinting process adopted by this molding method undergoes filling, cooling, and heteromorphism. The problem of lens molding through the molding/imprinting process is contraction and deformation due to the difference between the non-charging/air trap generation during the charging process of the micro lens array and the thermal expansion coefficient occurring during cooling. This problem causes a shape error between lenses and leads to lens shape deviation by position due to deformation of wafer units. For numerical analysis of processes above Tg (Glass Transition Temperature), a cross model was adopted to study multiphase flow simulation using VOF method and to consider the theoretical characteristics of PMMA. It has VOF techniques for free surface analysis, MDM techniques for glass molding, lens shaping analysis techniques, lens shape filling, cooling characteristics and contraction/deformation, and methods for evaluating heterogeneous characteristic analysis. It aims to develop an analysis technology to optimize the wafer level imaging lens formation process.