Korea Institute of Machinery and Materials (KIMM)
There has been an increase in demand for the development of lightweight and high-strength materials for application to mobility industry. Carbon fiber reinforced polymer (CFRP) is known as one of the most promising materials owing to its high strength-to-weight ratio. In an effort to apply CFRP in automotive and aircraft industries, many researchers have endeavored to study CFRP joining technology. Conventional joining methods are based on mechanical fastening or adhesive bonding. The both processes have several limitations and problems. For example, mechanical joining process typically requires hole drilling and external fasteners, which cause increase the structure weight and cost. On the other hand, adhesive bonding has high environmental issue and uncertainty about long-term structural integrity. In this respect, laser assisted joining has attracted interest as an alternative method, because it enables to provides short process time, high precision and environmentally friendly process. In this work, we have investigated laser assisted joining of carbon-fiber-reinforced polyetherketoneketone composites (CF-PEKK). The PEKK is a very high-performance thermoplastic polymer with an excellent mechanical and thermal-resistance properties [1-2]. Therefore, laser assisted joining of CF-PEKK/CF-PEKK is relatively challenging compared to the joining of other carbon fiber reinforced thermoplastic polymers. The heat penetration test of 2 mm-thick CF-PEKK and joining test for CF-PEKK/CF-PEKK were carried out by using near-infrared continuous wave fiber laser. In order to investigate joining mechanism, we performed material characterizations in the joining interface by using scanning electron microscopy (SEM) and high-resolution transmission electron microscopy (HRTEM). In addition, single lap shear tests were also carried out to prove mechanical strength of the laser assisted joining. Our study indicates that laser assisted joining method of CFRP/CFRP sheets are feasible and worth to explore further.
Abstract
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Poster
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