Sarangapani Murali and Narasimalu Srikanth (2007). Mechanical Cross-Sectioning of Au/Cu Wire Ball Bond with Underneath Cu/low-k Interconnect Layers. Practical Metallography: Vol. 44, No. 3, pp. 129-136. doi: 10.3139/147.100332 © Carl Hanser Verlag GmbH & Co. KG ISSN 0032-678X