The present study investigates the layer adhesion of 3D-printed multi-material compounds and their resulting (thermo)mechanical properties. The investigation is founded on the concept of “Design for Disassembly”, a term which refers to the fabrication of electronic compounds that are characterised by ease of disassembly. While the concept of disassembly has been demonstrated in a previous work, further examination of the interface between the multi-material layers is necessary. The findings of this investigation can facilitate the selection of materials and the optimisation of printing parameters.