As development and production of advanced materials and components progresses towards miniaturization and individualization and in the same time material purity and manufacturing quality increase significantly, failures in material and components become rarer and rarer but also more critical with regard to material and part performance. Often these distinctive features (impurities, inclusions, manufacturing flaws etc.) are deeply buried inside the part or component and sparsely distributed which makes a precise location and target preparation necessary to investigate the type of feature and the possible root cause. The most commonly used method for target preparation might be the standard materialographic approach following a CT-scan for feature localization, however targeting precision is highly depended on the machine and measurement equipment capabilities and even more on the Materialographers skill. Another method is a correlative approach combining CT or X-Ray-Microscopy with high-precision FIB preparation. The accuracy in this approach is basically only limited by the resolution of the correlated volumetric data/images and can in general be expected in the single-digit micron range, however based on the principle of FIB, preparation width and depth are highly limited to several tens of microns which makes this method only suitable for surface-near features. To bridge the gap with high precision preparation and the capability of accessing more deeply buried features, a femtosecond (fs-)Laser is added to a standard FIB/SEM. Fs-Laser preparation allows for rapid material ablation and thus access to features buried as deep as ~1 mm with no thermal damage of the sample material. By the example of microelectronic components as well as energy-storage and -conversion materials the straight forward correlative approach of using high-resolution X-Ray-Microscopy to located features in combination with fs-Laser assisted FIB/SEM preparation and investigation is outlined in the presented work. I can be shown that features with sizes around 20 µm and buried as deep as >700 µm can be precisely located and prepared for further investigation.